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Ultra Compact Wi-Fi 6/6E SiP Module for Wearable and Portable Devices

Compact Wi-Fi 6/6E SiP Module for 

 

Wearable and Portable Devices

As the demand for compact and highly integrated smart devices continues to grow, delivering reliable wireless connectivity while managing system complexity and power consumption has become critical. SparkLAN meets this need with the AP5811SA Wi-Fi 6/6E + Bluetooth 5.4 SiP module, designed to simplify integration and ensure stable wireless performance in portable and embedded devices.

Simplified Integration with Compact SiP Design

 

The AP5811SA features a System-in-Package (SiP) architecture with WLBGA packaging, measuring only 7.9 × 7.3 x 1.1 mm, making it ideal for space-constrained applications. Its compact form factor and low power design enable device manufacturers to integrate wireless connectivity into lightweight and portable products while maintaining efficient system performance.

 

Supporting IEEE 802.11ax/ac/a/b/g/n, the module operates across 2.4GHz, 5GHz, and 6GHz bands, providing stable and flexible connectivity in modern wireless environments. The integration of an Internal XTAL reduces external component requirements and simplifies hardware design, while silver-plated RF shielding enhances RF stability and minimizes interference.

 

The AP5811SA utilizes an SDIO 3.0 / 2.0 interface for Wi-Fi connectivity and supports Linux and Android operating systems, enabling efficient integration into embedded platforms. In addition, the module includes Bluetooth 5.4, supporting short-range wireless communication within a single compact solution.

Enabling a Wide Range of Connected Applications

 

With its compact size and integrated design, the AP5811SA is suitable for a wide range of connected devices. These include smart home control panels, OTT streaming devices, AR/VR devices, POS terminals, self-service kiosks, medical devices, and digital signage players, where reliable network connectivity is essential for cloud services, content delivery, and device management.

 

The module is also well suited for wearable and portable smart devices, such as smart glasses, body cameras, and portable health monitoring equipment, where space efficiency and stable wireless performance are critical design considerations.

 

The AP5811SA is regulatory ready with FCC, CE, IC, and TELEC certifications, and samples are available for customer evaluation and system development.

●   Wi-Fi 6/6E + Bluetooth 5.4 Combo SiP Module
●   Chipset: Synaptics
●   Tri-band Operation: 2.4 / 5 / 6 GHz
●   Interface: SDIO V3.0/2.0 ; Bluetooth:UART / I2S
●   Compact 7.9 × 7.3 x 1.1 mm WLBGA Package
●   Integrated Internal XTAL for simplified design
●   Silver-Plated RF Shielding for enhanced RF stability
●   Temperature Range: -40°C ~ 85°C
●   Support Linux and Android
●   Global Certifications: FCC / CE / IC / TELEC
FCC Certification Logo
CE
IC Certification Logo
MIC Certification Logo

Application Scenarios

Smart Control Panels & Displays

Smart home panels, building controls with real-time monitoring and cloud connectivity

AP5811SA Application1

AR / VR  Devices

AR glasses and VR headsets with low-latency connectivity for immersive applications

AP5811SA Application2

POS & Self-Service Terminals

POS, kiosks, and vending machines with reliable data transmission and remote management

AP5811SA Application3

OTT Streaming  Devices

Streaming boxes and media players with stable wireless content delivery

AP5811SA Application4

Medical Deivce

Portable ultrasound and monitoring devices with wireless data transmission and system integration

AP5811SA Application5

Wearable Deivce

Smart glasses and body cameras with real-time data transmission and seamless connectivity

AP5811SA Application6