Meet Us at Computex 2024 | SparkLAN x AMPAK
INNOVATING ● TECHNOLOGY ● CONNECTIVITY Join Us at Computex Taipei 2024 – SparkLAN & AMPAK Technology As the tech world converges to showcase and...
Read MoreINNOVATING ● TECHNOLOGY ● CONNECTIVITY Join Us at Computex Taipei 2024 – SparkLAN & AMPAK Technology As the tech world converges to showcase and...
Read MoreInnovating Connectivity AP6676SDSR and WNFS-267AXI(BT) SparkLAN has launched the AP6676SDSR Sip module and WNFS-267AXI(BT) M.2 module, adopted WiFi 6/6E tri-band, integrated with Bluetooth 5.3, and powered...
Read MoreSparkLAN’s Wi-Fi 6 & BLE SiP Module with TI Tech SparkLAN has launched WL62031XI SiP (System-in-Package) module, which is a low...
Read MoreComputex Taipei 2023 Invitation We cordially invite you to join us for the joint exhibition of SparkLAN Communications and AMPAK Technology at Computex Taipei 2023 during May...
Read MoreAP6275S 802.11ax/ac/a/b/g/n Wi-Fi Combo SiP Module (Wi-Fi 6, 2T2R) Interface: WLAN:SDIO 3.0 & BT: UART/ PCM Operating Temp:-30 ~ 85°C Support: Linux, Android Pre-integrated Platform Rockchip Amlogic Allwinner Recommend Application OTT...
Read MoreInternet of Things uses sensor technologies to acquire information, such as the status, location, and properties of the physical world...
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