SparkLAN & AMPAK to Showcase Edge AIoT at Computex 2026

SparkLAN and AMPAK will co-exhibit at COMPUTEX 2026, presenting next generation Edge AI and advanced wireless connectivity solutions. This year’s showcase will feature AI Box PC, 5G RedCap technology, System on Module (SoM), System in Package (SiP), and Wi-Fi 7 modules designed to support scalable AIoT deployments across industrial and smart infrastructure environments.

By integrating high performance wireless communication with edge computing capabilities, our solutions enable reliable, efficient, and flexible connectivity for next generation applications, including emerging use cases such as 5G RedCap enabled drone operations, where stable,
low latency connectivity is essential for real time control and data transmission.

Visit our booth to explore how SparkLAN and AMPAK are advancing the future of intelligent connectivity. Join us at the Taipei Nangang Exhibition Center, Hall 1, 1F, Advanced Communication & Networking Zone, Booth No. K0323a.