SparkLAN & AMPAK to Showcase Edge AIoT at Computex 2026 SparkLAN and AMPAK will co-exhibit at COMPUTEX 2026, presenting next generation Edge...
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SparkLAN & AMPAK to Showcase Edge AIoT at Computex 2026 SparkLAN and AMPAK will co-exhibit at COMPUTEX 2026, presenting next generation Edge...
Read MoreCompact Wi-Fi 6/6E SiP Module for Wearable and Portable Devices As the demand for compact and highly integrated smart devices continues to...
Read MoreSpeed Meets Intelligence – AI New Era of Connected Design In today’s intelligent world, connectivity is more than data transfer,...
Read More5G RedCap Enables a Complete and Scalable IoT Deployment As industries accelerate digital transformation, the need to connect millions of devices :...
Read MoreWi-Fi 6 + Bluetooth 5.3 SiP Module Built for Embedded Systems SparkLAN’s AP5875PA is a highly integrated Wi-Fi 6 + Bluetooth 5.3...
Read MoreNew SiP & WiFi Module Ready to Ship with Multi-Country Regulation SparkLAN’s new SiP and Wi-Fi modules are now ready to ship with...
Read MoreThank You for Visiting SparkLAN & AMPAK at COMPUTEX 2025 SparkLAN sincerely thank you for visiting our booth at COMPUTEX 2025. It...
Read MoreSparkLAN & AMPAK to Showcase 5G A-IoT Solutions at Computex 2025 SparkLAN and AMPAK will co-exhibit at COMPUTEX 2025, unveiling the latest breakthroughs in 5G RedCap,...
Read MoreUnveiling 5G RedCap 5G RedCap, also known as NR-Light, represents a streamlined version of the 5G New Radio (NR) standard, tailored...
Read MoreAdvanced Wi-Fi 7 Modules for AI PC and High-Performance IoT SparkLAN introduces the WNFQ-290BE and WNSQ-290BE modules, designed to deliver high-performance wireless connectivity ideal for...
Read MoreSparkLAN Advanced Wireless SiP Modules – Compact, High-Performance WiFi 6/6E and Bluetooth SiP Solution SparkLAN introduces three advanced wireless modules: AP5811SA, AP5875SA, and AP6611S. Both AP5811SA and...
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