SparkLAN Advanced Wireless SiP Modules 

– Compact, High-Performance

WiFi 6/6E and Bluetooth SiP Solution

SparkLAN introduces three advanced wireless modules: AP5811SA, AP5875SA, and AP6611S. Both AP5811SA and AP5875SA feature a compact WLBGA package (Minimum size 7.9 x 7.3 x 1.0mm) with Internal X’tal and silver-plated RF shielding.

The AP5811SA is a WiFi 6E and Bluetooth 5.3 combo module, supports 2.4/5/6GHz bands, ensuring seamless roaming, enhanced security, and high-performance connectivity, ideal for tablets, OTT boxes, and mobile devices. The AP5875SA, featuring WiFi 6 and Bluetooth 5.1, offers robust performance with OFDMA, 1024QAM, TWT, and MU-MIMO technologies, making it perfect for dense environments.The AP6611S is a WiFi 6E and Bluetooth 5.3 module, supports 2.4/5/6GHz bands, ensuring versatile connectivity for various portable devices.

All three modules support Linux and Android drivers, providing flexibility and ease of integration across different platforms and are designed for wide temperature ranges -30°C ~85°C, ensuring reliability in diverse applications.

Wi-Fi 6E with Bluetooth 5.3  1T1R SiP Solution

• Chipset: Synaptics
• Internal Xtal and  Silver-Plated RF Shielding
• Interface: 

     WLAN: SDIO 3.0/2.0  ;  Bluetooth:UART / I2S

• Operating Temperature: -30~ 85°C
• Compact WLBGA
• Package 7.9 x 7.3 x 1 mm
• Support Linux, Andriod

Wi-Fi 6 with Bluetooth 5.1  2T2R SiP Solution

• Chipset: Synaptics
• Internal Xtal and  Silver-Plated RF Shielding
• Interface: 

     WLAN: SDIO 3.0/2.0  ;  Bluetooth:UART/PCM

• Operating Temperature: -30~ 85°C
• Compact WLBGA
• Package 10 x10 x 0.98 mm
• Support Linux, Andriod

Wi-Fi 6E with Bluetooth 5.3  1T1R SiP Solution

• Chipset: Synaptics
• Interface: 

     WLAN: SDIO 3.0/2.0  ;  Bluetooth:UART/PCM

• Operating Temperature: -30~ 85°C
• Compact Size:  12 x 12 x 1.8mm
• Support Linux, Andriod

Application Scence

The compact wireless modules are ideal for tablets, OTT boxes, and portable devices. They ensure reliable connectivity in smart homes, IoT, and industrial settings with seamless roaming, enhanced security, and wide temperature support for diverse  applications.