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WLRS-592 Series

LoRa IoT Module Frequency: CN 470MHz, SX1278


  • Chipset: Semtech SX1278
  • Interface: UART, SPI, I2C, USB,ADC
  • MCU: STM32L073xZ ARM Coretex-M0+32-bit
  • Frequency: CN 470MHz
  • Embedded memories (up to 192k bytes of Flash memory and 20k bytes of RAM)
  • 3 x UART
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Enquire Here Datasheet

Product Overview


The WLRS-592 is designed & manufactured in a smallest form factor -SiP (System in Package). The WLRS-592 integrates with Semtech SX1278 and a 32-bit ultra-low power Cortex M0+ MCU (STM32L073x).


The WLRS-592 is a general purpose SiP for sensor integration. Sensor vendors can speed up their LPWAN integration by embedding this SiP in their design. The WLRS-592 can achieve a sensitivity of over -138dBm.

The high sensitivity combined with the integrated +20dBm power amplifier yields industry leading link budget marking it optimal for any low data rate application requiring range or robustness.


The WLRS-592 is based on LoRa technology to provides low power long range high sensitivity communication using spread spectrum. The WLRS-592 also provides significant advantages in both blocking and selectivity over conventional modulation techniques, solving the traditional design compromise between range, interference immunity and energy consumption. WLRS-592 module provides a commands set interface that can use LoRa and LoRaWAN communication through UART interface.

Suitable Application


● Automated Meter Reading
● Intelligent tracking
● Wireless Alarm and Security Systems
● Industrial Monitoring and Control
● Long range Irrigation Systems
● Forest fire detection
● Healthcare Application



Environmental Compliance


ROHS Reach



MCU STM32L073xZ  ARM Coretex-M0+32-bit
Chipset Semtech SX1278
Frequency CN 470MHz 
Flash Memory/RAM 192k bytes/20k bytes
Form Factor
Interface UART, SPI, I2C, USB,ADC
Antenna External
Transmitter Power 20dBm
Receive Sensitivity -138dBm
Temperature -40°C~85°C (Operating)

-50°C~105°C (Storage)

Humidity (No-Condensing) Operating: 10~95% (No-Condensing)

Storage: 5~95% (No-Condensing)

Input Voltage 3.3V
Package Molding type with LGA landing
Dimension (mm)
L:13mm x W:11mm x H:1.1mm