Join Us at Computex Taipei 2024

 

– SparkLAN & AMPAK Technology

As the tech world converges to showcase and explore the latest advancements, SparkLAN and  AMPAK will once again hold a joint exhibition at Computex 2024. This premier event, taking place from June 4th to June 7th at the Taipei Nangang Exhibition Center. Our location in TaiNex 1, the area of IoT and Smart Technology, at Booth N0929a. We’re showcasing groundbreaking technologies that redefine high-speed connectivity and smart technology solutions, offering a preview of the tech industry’s future.

 

At Computex Taipei 2024, our highlighted innovations include:

 

● 5G A-IoT Module: Explore 5G solutions for ultra-fast connectivity, ushering in a new era of communication.

 

● WiFi 7 Module Solution: Latest WiFi 7 and WiFi 6/6E modules, designed to redefine possible in wireless connectivity with high speed and efficiency.

 

● SOM Solution: Experience the flexibility and adaptability of System on Module (SOM) solution.

 

● SiP Module Series: Explore the compact power of System in Package (SiP) modules with various type module.

 

 

We look forward to welcoming you to our booth and exploring how we can move towards a more connected and innovative future together.