SparkLAN will launch WiFi SiP module for embedded IoT applications with Broadcom Solution
SparkLAN will launch WiFi SiP module for
embedded IoT applications with Broadcom Solution
Sparklan is going to launch SiP module (with size 12x12mm, 13x15mm) for embedded IoT applications which can be applied on a tablet, OTT box, portable devices, and home security products. SiP module is utilized Broadcom WiFi solutions.
SparkLAN provides unmatched connectivity solutions for the Internet of Things. Its 802.11ac chips offer the fastest and most power-efficient consumer download experiences with more robust and more reliable connections. Broadcom Combo solution (802.11ac, Dual-Band WiFi + Bluetooth 5.0, Interface: SDIO) can benefit IoT applications for complex solutions with Audio/Video entertainment, while maintaining robust connections, offering improved network performance for multiple users using.
11ac combo solutions can provide high-performance WiFi transmission to fulfill customers’ high-speed WiFi requirements in the IoT market. Increase in demand for high speed and compact size of electronic products has fueled the requirement of SiP technology. We also provide the lowest cost of 802.11bgn WiFi SDIO SiP module solution.
We are pleased to have developers of emerging IoT applications are increasingly asking for the high performance and advanced coexistence that our dual-band 802.11ac solutions offer.
SparkLAN is dedicated to design-in, marketing and sales of top quality wireless solution. Our product range includes commercial grade and Industrial grade wireless modules solution. We provide technical support, consultation, and module, from customer initial development phase right through to production and beyond. Short communication channels within our organisation guarantee rapid and highly competent care and attention.