SparkLAN and AMPAK will co-exhibit at COMPUTEX 2025, unveiling the latest breakthroughs in 5G RedCap, System on Module (SoM), System in Package (SiP), and Wi-Fi 7 technologies. Our showcase will highlight high-performance wireless solutions designed to meet the evolving demands of modern industries, delivering enhanced reliability, efficiency, and scalability.

We invite you to visit our booth and experience these cutting-edge innovations. Discover SparkLAN and AMPAK’s advanced wireless technologies are shaping the future of connectivity. Join us from May 20 to May 23, 2025, at the Taipei Nangang Exhibition Center, Hall 1,  Booth No. K0824, Advanced Communications & Networking Zone.