Wi-Fi 6 + Bluetooth 5.3 SiP Module

Built for Embedded Systems

SparkLAN’s AP5875PA is a highly integrated Wi-Fi 6 + Bluetooth 5.3 SiP module designed for compact embedded systems. With a 10x10mm footprint, it combines dual-band 802.11ax (2T2R), Bluetooth 5.3, and an internal crystal oscillator (XTAL), reducing external component requirements and simplifying design. Built on a Synaptics chipset, it supports data rates up to 1200 Mbps, with PCIe v3.0 for Wi-Fi and UART/PCM for Bluetooth—providing fast, efficient connectivity with broad platform compatibility, including Linux and Android.

Engineered for high-density environments, the AP5875PA leverages OFDMA, MU-MIMO, and Target Wake Time (TWT) to optimize bandwidth and power consumption. The integrated XTAL ensures stable signal performance and improves overall system reliability. Whether for AIoT devices, industrial systems, or smart medical equipment, the AP5875PA offers a compact, reliable wireless solution tailored to embedded connectivity demands.

 Product Key Feature

The AP5875PA brings together essential wireless technologies in a compact 10×10 mm SiP design, combining dual-band Wi-Fi 6 and Bluetooth 5.3 in one module. It’s not just small—it’s packed with performance and flexibility, enabling high-speed connectivity, low latency, and simplified system integration for embedded and AIoT applications.

 Application Range

Compact wireless connectivity is essential for modern embedded designs, especially where space and power efficiency are critical. The AP5875PA combines dual-band Wi-Fi 6 and Bluetooth 5.3, delivering reliable data and audio transmission for applications such as portable medical equipment, industrial gateways, and in-vehicle systems, where stable performance is non-negotiable.