AP6275P is an 802.11ax (WiFi 6) SiP Module, 802.11ax allow Increased capacity, faster speed, better coverage connections, improve the battery life of IoT sensors, which extends the benefits of Wi-Fi 6 to the broader smartphone market where high performance and total solution cost are equally important design considerations. AP6275P is a highly integrated chip that brings together the latest innovations in Wi-Fi 6 to offer smartphone makers a cost effective, high-performance connectivity solution.
It supports key Wi-Fi 6 innovations including OFDMA and MU-MIMO technologies for better performance in crowded environments, advanced roaming capabilities, and WPA3 security protocols. The Wi-Fi and Bluetooth 5.0 functionalities module with seamless roaming capabilities and advanced security. Furthermore the included PCIe v3.0 interface for Wi-Fi, UART/ PCM interface for Bluetooth.
This compact module is a total solution for a combination of 11ax WiFi 6+ BT 5.0 technologies. The module is specifically developed for tablets, AR, VR, IoT, Smartphone, service provider & Home Appliance, and portable devices.
|WI-FI||IEEE 802.11 ax/ac/a/b/g/n 2T2R Wi-Fi + BT 5.0 Module|
|Host Interface||WLAN: PCIe|
2.4GHz ISM Band: 2.400GHz~2.835GHz
5GHz UNII Band: 5.15~5.35GHz、5.47~5.725GHz、5.725~5.85GHz
|802.11b||DSSS (DBPSK, DQPSK, CCK)|
|802.11g||OFDM (BPSK, QPSK, 16-QAM, 64-QAM)|
|802.11a||OFDM (BPSK, QPSK, 16-QAM, 64-QAM)|
|802.11n||OFDM (BPSK, QPSK, 16-QAM, 64-QAM)|
|802.11ac||OFDM (BPSK, QPSK, 16-QAM, 64-QAM, 256-QAM)|
|802.11ax||OFDMA (BPSK, QPSK, 16-QAM, 64-QAM, 256-QAM, 1024-QAM)|
|Temperature Range||-30~ 85°C (Operating)||-40 ~ 105°C (Storing)|
|Humidity (Non-Condensing)||10 ~ 95% (Operating)|
|Dimension L x W x H (in mm)||15mm(±0.2mm) x 13 mm(±0.2mm) x 1.55 mm(Max)|
|Security||64/128-bits WEP, WPA, WPA2, WPA3, 802.1x|