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Advanced Wi-Fi 7 Module for Next-Generation Application

Next-Gen Connectivity Unleashed

 

WiFi 7 Module Power AI PC & Embedded System

SparkLAN’s WNFQ-293BE(BT) and WNSQ-293BE(BT) redefine embedded systems can expect from  WiFi 7 connectivity. Built for fast-moving edge environments, the

Wi-Fi 7 modules combine high-speed tri-band performance with robust industrial reliability—all in compact, flexible form factors.

 

Offered in both socketed and solder-down module types, WNFQ-293BE(BT) and WNSQ-293BE(BT) ensure easy integration across x86 and ARM platforms. With Linux driver support and flexible hardware interfaces including PCIe (Wi-Fi) and USB/UART (Bluetooth), developers can seamlessly embed wireless connectivity into a wide range

of industrial and AIoT systems.

 

Designed with next-generation devices, WNFQ-293BE(BT) and WNSQ-293BE(BT) support advanced wireless features such as Multi-Link Operation (MLO), 160 MHz bandwidth, and 4096-QAM modulation, enabling smooth, low-latency communication even in congested or mission-critical environments. Whether deployed in AI-powered controllers, rugged gateways, or smart mobility platforms, the modules provide the speed, reliability, and scalability required for intelligent edge connectivity. WNFQ-293BE(BT) and WNSQ-293BE(BT) series deliver the wireless foundation to power the future of connected systems.

WiFi 7 – WNFQ-293BE(BT)/ WNSQ-293BE(BT)

802.11be  Tri-band  WiFi + Bluetooth 5.4  M.2 2230 / 1620 LGA  Module

WNFQ-293BE(BT)

 

WiFi 7 Tri-band WiFi + Bluetooth 5.4 

M.2 2230 (E KEY) Module, 2T2R

 

● Interface:   WLAN: PCIe ; Bluetooth: USB
● Operating Temperature.: -30°C ~ 85°C
● Support: Linux

WNSQ-293BE(BT)

 

WiFi 7 Tri-band WiFi + Bluetooth 5.4 

M.2 LGA 1620 Type Module, 2T2R

 

● Interface:   WLAN: PCIe ; Bluetooth: USB or UART
● Operating Temperature.: -30°C ~ 85°C
● Support: Linux

Upgrade Your WiFi 

WNFQ-293BE(BT) and WNSQ-293BE(BT) offer seamless wireless performance and design flexibility for integration into AIoT platforms, industrial systems, robotics, smart vehicles, and embedded edge devices.